ICM7555IPA+
vs
TLC555CPWG4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
PLASTIC, DIP-8
|
TSSOP, TSSOP14,.25
|
| Pin Count |
8
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SQUARE
|
PULSE; RECTANGULAR
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e4
|
| Length |
9.375 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Output Frequency-Max |
0.5 MHz
|
1.2 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
4
|
1
|
| Additional Feature |
|
IT CAN ALSO OPERATE AT 2 V OR 15 V NOMINAL SUPPLY
|
|
|
|
Compare ICM7555IPA+ with alternatives
Compare TLC555CPWG4 with alternatives