ICM7555CN,602 vs ICM7555CN/01,112 feature comparison

ICM7555CN,602 NXP Semiconductors

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ICM7555CN/01,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 0.300 INCH, PLASTIC, MO-001, SC504-8, SOT97-1, DIP-8
Pin Count 8 8
Manufacturer Package Code SOT97-1 SOT97-1
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP NXP
Analog IC - Other Type PULSE PULSE
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.5 mm 9.5 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Frequency-Max 0.5 MHz 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 250 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.2 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare ICM7555CN,602 with alternatives

Compare ICM7555CN/01,112 with alternatives