ICM7362MG
vs
ICM7362M
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
IC MICROSYSTEMS SDN BHD
|
IC MICROSYSTEMS SDN BHD
|
| Part Package Code |
MSOP
|
MSOP
|
| Package Description |
TSSOP,
|
TSSOP,
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G10
|
| Length |
3 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.293%
|
0.293%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1176 mm
|
1.1176 mm
|
| Settling Time-Nom (tstl) |
8 µs
|
8 µs
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|