ICL8038BMJD
vs
ICL8038BMJD/883C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
GENERAL ELECTRIC SOLID STATE
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE
WAVEFORM GENERATION
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Neg Supply Voltage-Max (Vsup)
-15 V
Neg Supply Voltage-Min (Vsup)
-5 V
Neg Supply Voltage-Nom (Vsup)
-10 V
Number of Functions
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Frequency-Max
0.1 MHz
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
15 mA
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
5 V
Supply Voltage-Nom (Vsup)
10 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Screening Level
MIL-STD-883 Class C
Compare ICL8038BMJD with alternatives
Compare ICL8038BMJD/883C with alternatives