IBM25PPC750GXECR2H33T
vs
IBM25PPC750GXEAB2532T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA,
21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
Pin Count
292
292
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
200 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B292
S-CBGA-B292
Length
21 mm
21 mm
Low Power Mode
YES
YES
Number of Terminals
292
292
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.137 mm
3.137 mm
Speed
800 MHz
800 MHz
Supply Voltage-Max
1.5 V
1.5 V
Supply Voltage-Min
1.4 V
1.4 V
Supply Voltage-Nom
1.45 V
1.45 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Package Equivalence Code
BGA292,20X20,40
Compare IBM25PPC750GXECR2H33T with alternatives
Compare IBM25PPC750GXEAB2532T with alternatives