IBM25PPC750GLECR5HB3T vs IBM25PPC750FX-GR0132T feature comparison

IBM25PPC750GLECR5HB3T IBM

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IBM25PPC750FX-GR0132T IBM

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292
Pin Count 292 292
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 4 Weeks
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 200 MHz 600 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-CBGA-B292 S-CBGA-B292
JESD-609 Code e1 e1
Length 21 mm 21 mm
Low Power Mode YES NO
Number of Terminals 292 292
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA292,20X20,40 BGA292,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.137 mm 2.828 mm
Speed 1000 MHz 600 MHz
Supply Voltage-Max 1.55 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 21 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare IBM25PPC750GLECR5HB3T with alternatives

Compare IBM25PPC750FX-GR0132T with alternatives