IBM25PPC750GLECR2H34T
vs
IBM25PPC750GLECR5H44T
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
IBM MICROELECTRONICS
|
IBM MICROELECTRONICS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
|
21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
|
Pin Count |
292
|
292
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
200 MHz
|
200 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B292
|
S-CBGA-B292
|
JESD-609 Code |
e1
|
e1
|
Length |
21 mm
|
21 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
292
|
292
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA292,20X20,40
|
BGA292,20X20,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.137 mm
|
3.137 mm
|
Speed |
1000 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.5 V
|
1.55 V
|
Supply Voltage-Min |
1.4 V
|
1.45 V
|
Supply Voltage-Nom |
1.45 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7)
|
Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
21 mm
|
21 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IBM25PPC750GLECR2H34T with alternatives
Compare IBM25PPC750GLECR5H44T with alternatives