IBM25PPC750FX-DB2512T vs IBM25PPC750GXEBR6592T feature comparison

IBM25PPC750FX-DB2512T IBM

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IBM25PPC750GXEBR6592T IBM

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, BGA292,20X20,40 BGA,
Pin Count 292 292
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 200 MHz 200 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B292 S-CBGA-B292
Length 21.02 mm 21 mm
Low Power Mode YES YES
Number of Terminals 292 292
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA292,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.087 mm 3.137 mm
Speed 800 MHz 1000 MHz
Supply Voltage-Max 1.5 V 1.55 V
Supply Voltage-Min 1.4 V 1.45 V
Supply Voltage-Nom 1.45 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 21.02 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare IBM25PPC750FX-DB2512T with alternatives

Compare IBM25PPC750GXEBR6592T with alternatives