IBM25PPC750FL-GR0133T vs IBM25PPC750FX-GR0132T feature comparison

IBM25PPC750FL-GR0133T IBM

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IBM25PPC750FX-GR0132T IBM

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Pbfree Code Yes Yes
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description 21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292 21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292
Pin Count 292 292
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 4 Weeks
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 200 MHz 600 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B292 S-CBGA-B292
JESD-609 Code e1 e1
Length 21 mm 21 mm
Low Power Mode YES NO
Number of Terminals 292 292
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA292,20X20,40 BGA292,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.828 mm 2.828 mm
Speed 600 MHz 600 MHz
Supply Voltage-Max 1.5 V
Supply Voltage-Min 1.4 V
Supply Voltage-Nom 1.45 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 21 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Moisture Sensitivity Level 3

Compare IBM25PPC750FL-GR0133T with alternatives

Compare IBM25PPC750FX-GR0132T with alternatives