IBM25PPC750CXEJQ5513T
vs
XPC850SRCZT50B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA, BGA256,20X20,50
|
BGA, BGA256,16X16,50
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
50 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
27 mm
|
23 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA256,16X16,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.666 mm
|
2.35 mm
|
| Speed |
533 MHz
|
50 MHz
|
| Supply Voltage-Max |
1.9 V
|
3.465 V
|
| Supply Voltage-Min |
1.7 V
|
3.135 V
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
27 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
3
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
95 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare IBM25PPC750CXEJQ5513T with alternatives
Compare XPC850SRCZT50B with alternatives