IBM25PPC750CX-CP50-3T
vs
IBM25PPC750CXEJP5012T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA, BGA256,20X20,50
LBGA, BGA256,20X20,50
Pin Count
256
256
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
85 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,20X20,50
BGA256,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Speed
500 MHz
500 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Seated Height-Max
1.666 mm
Compare IBM25PPC750CX-CP50-3T with alternatives
Compare IBM25PPC750CXEJP5012T with alternatives