IBM25PPC405GP-3BD200C vs PPC405GP-3BE266CZ feature comparison

IBM25PPC405GP-3BD200C IBM

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PPC405GP-3BE266CZ Applied Micro Circuits Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS APPLIED MICRO CIRCUITS CORP
Part Package Code BGA BGA
Package Description 35 MM, PLASTIC, BGA-456 BGA, BGA456,26X26,50
Pin Count 456 456
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY FOR I/O ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.6 MHz 66.66 MHz
External Data Bus Width 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 456 456
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Speed 200 MHz 266 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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