IBM25NPE405L-3FA200C
vs
AT572D940HF-CL
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA324,22X22,40
|
CABGA-324
|
| Pin Count |
324
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
13
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.66 MHz
|
50 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| Length |
23 mm
|
15 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Equivalence Code |
BGA324,22X22,40
|
BGA324,18X18,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.5 mm
|
| Speed |
200 MHz
|
|
| Supply Current-Max |
600 mA
|
|
| Supply Voltage-Max |
2.7 V
|
1.26 V
|
| Supply Voltage-Min |
2.3 V
|
1.14 V
|
| Supply Voltage-Nom |
2.5 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Barrel Shifter |
|
YES
|
| Internal Bus Architecture |
|
MULTIPLE
|
| Number of DMA Channels |
|
1
|
| Number of External Interrupts |
|
3
|
| Number of Serial I/Os |
|
12
|
| Number of Timers |
|
3
|
| On Chip Data RAM Width |
|
1
|
| On Chip Program ROM Width |
|
128
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| RAM (words) |
|
1782579
|
| ROM Programmability |
|
FLASH
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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