Findchips: Compare IBM25EMPPC750LEBF3000 vs IBM25EMPPC750LDBF3000

IBM25EMPPC750LEBF3000 vs IBM25EMPPC750LDBF3000 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Contact Manufacturer	Contact Manufacturer
Ihs Manufacturer	IBM MICROELECTRONICS	IBM MICROELECTRONICS
Part Package Code	BGA	BGA
Package Description	BGA,	BGA,
Pin Count	360	360
Reach Compliance Code	unknown	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	100 MHz	100 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	NO	NO
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Operating Temperature-Max	105 °C	105 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	3.2 mm
Speed	300 MHz	300 MHz
Supply Voltage-Max	2.1 V	2.1 V
Supply Voltage-Min	1.9 V	1.9 V
Supply Voltage-Nom	2 V	2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors