IBM25EMPPC750LEBA4000 vs IBM25EMPPC750LDBB4000 feature comparison

IBM25EMPPC750LEBA4000 IBM

Buy Now Datasheet

IBM25EMPPC750LDBB4000 IBM

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer IBM MICROELECTRONICS IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 360 360
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 65 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare IBM25EMPPC750LEBA4000 with alternatives

Compare IBM25EMPPC750LDBB4000 with alternatives