IBM21S760 vs HBLXT9763HC.C4 feature comparison

IBM21S760 IBM

Buy Now Datasheet

HBLXT9763HC.C4 Inphi Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer IBM MICROELECTRONICS INPHI CORP
Part Package Code QFP
Package Description LFQFP,
Pin Count 80
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G80 S-PQFP-G208
JESD-609 Code e0
Length 12 mm
Number of Functions 1
Number of Terminals 80 208
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 12 mm
Base Number Matches 1 3
Data Rate 100000 Mbps
Number of Transceivers 6
Package Equivalence Code QFP208,1.2SQ,20
Supply Current-Max 780 mA

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