IBM025160LG5B-70
vs
TMS55160-70DGH
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SSOP,
|
PLASTIC, SOP-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.02
|
|
| Access Mode |
FAST PAGE
|
FAST PAGE
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
RAS ONLY/CAS BEFORE RAS REFRESH; 256 X 16 SAM PORT
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
|
| JESD-30 Code |
R-PDSO-G64
|
R-PDSO-G64
|
| Length |
26.3 mm
|
26.295 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
VIDEO DRAM
|
VIDEO DRAM
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
64
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX16
|
256KX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Refresh Cycles |
512
|
|
| Seated Height-Max |
2.38 mm
|
2.38 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
12 mm
|
12.04 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
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