IBM0117805BT350 vs TMS427809AP-50DGC feature comparison

IBM0117805BT350 IBM

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TMS427809AP-50DGC Texas Instruments

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS TEXAS INSTRUMENTS INC
Part Package Code TSOP TSOP
Package Description 0.400 X 0.725 INCH, TSOP2-28 TSOP2, TSOP28,.46
Pin Count 28 28
Reach Compliance Code unknown not_compliant
Access Mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Access Time-Max 50 ns 50 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/BATTERY BACKUP/SELF REFRESH
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0
Length 18.41 mm 18.41 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type EDO DRAM EDO DRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 2048 2048
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10.16 mm 10.16 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.02
I/O Type COMMON
Package Equivalence Code TSOP28,.46
Self Refresh YES
Standby Current-Max 0.00015 A
Supply Current-Max 0.12 mA

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