I74F786D vs N74F786N feature comparison

I74F786D NXP Semiconductors

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N74F786N NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description 3.90 MM, PLASTIC, SO-16 DIP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e4
Moisture Sensitivity Level 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Supply Current-Max 80 mA 80 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR
Base Number Matches 2 3

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