I74F657N,112
vs
5962-8953501LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
QP SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IOL @ VCC = 4.75V; IOL = 24MA @ VOL = 0.5V FOR PORT A; IOH = 3MA @ VOH = 2.4V FOR PORT A
Control Type
COMMON CONTROL
Count Direction
BIDIRECTIONAL
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
Length
31.7 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Max I(ol)
0.064 A
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
245
Power Supply Current-Max (ICC)
160 mA
Prop. Delay@Nom-Sup
9 ns
Propagation Delay (tpd)
9 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
BIPOLAR
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
Base Number Matches
1
5
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