I74F32D
vs
SN74S32FN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.25
|
QCCJ,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
S
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-J20
|
| JESD-609 Code |
e4
|
|
| Length |
8.65 mm
|
8.9662 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Max I(ol) |
0.02 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
15.5 mA
|
|
| Prop. Delay@Nom-Sup |
5.6 ns
|
|
| Propagation Delay (tpd) |
6.6 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.75 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
8.9662 mm
|
| Base Number Matches |
6
|
2
|
|
|
|
Compare I74F32D with alternatives
Compare SN74S32FN with alternatives