I74F161AD,112
vs
MC74ACT163DWR2
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ON SEMICONDUCTOR
|
| Part Package Code |
SOP
|
SOIC
|
| Package Description |
SOP, SOP16,.25
|
SOP, SOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT109-1
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
UP
|
UP
|
| Family |
F/FAST
|
ACT
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.9 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
75000000 Hz
|
105000000 Hz
|
| Max I(ol) |
0.02 A
|
0.024 A
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
65 mA
|
|
| Propagation Delay (tpd) |
11 ns
|
12 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
3.9 mm
|
3.9 mm
|
| fmax-Min |
75 MHz
|
105 MHz
|
| Base Number Matches |
1
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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