I74F157AD,112 vs QS74FCT158TP feature comparison

I74F157AD,112 NXP Semiconductors

Buy Now Datasheet

QS74FCT158TP Quality Semiconductor Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS QUALITY SEMICONDUCTOR INC
Part Package Code SOP
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16
Manufacturer Package Code SOT109-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family F/FAST FCT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.02 A 0.048 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 23 mA
Prop. Delay@Nom-Sup 7.5 ns 6 ns
Propagation Delay (tpd) 7.5 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF

Compare I74F157AD,112 with alternatives

Compare QS74FCT158TP with alternatives