I74F157AD,112 vs MC74F157ADR2 feature comparison

I74F157AD,112 NXP Semiconductors

Buy Now Datasheet

MC74F157ADR2 Motorola Semiconductor Products

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP
Package Description SOP, SOP16,.25 SOP,
Pin Count 16
Manufacturer Package Code SOT109-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 9.9 mm 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.02 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 23 mA 23 mA
Prop. Delay@Nom-Sup 7.5 ns
Propagation Delay (tpd) 7.5 ns 8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF

Compare I74F157AD,112 with alternatives

Compare MC74F157ADR2 with alternatives