I74F157AD,112
vs
JM38510/33909BFA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
SOP
|
|
| Package Description |
SOP, SOP16,.25
|
DFP,
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT109-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
9.65 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.02 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
2
|
| Number of Inputs |
2
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supply Current-Max (ICC) |
23 mA
|
|
| Prop. Delay@Nom-Sup |
7.5 ns
|
|
| Propagation Delay (tpd) |
7.5 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.15 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
6.415 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare I74F157AD,112 with alternatives
Compare JM38510/33909BFA with alternatives