I74F157AD,112 vs IDT54FCT257TPB feature comparison

I74F157AD,112 NXP Semiconductors

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IDT54FCT257TPB Integrated Device Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOP DIP
Package Description SOP, SOP16,.25 DIP,
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST FCT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm 19.1135 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.02 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 23 mA
Prop. Delay@Nom-Sup 7.5 ns
Propagation Delay (tpd) 7.5 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.191 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Output Characteristics 3-STATE

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