I1750PYIR vs ISD1616BSYI01 feature comparison

I1750PYIR Winbond Electronics Corp

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ISD1616BSYI01 Nuvoton Technology Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUVOTON TECHNOLOGY CORP
Part Package Code DIP SOIC
Package Description DIP, 0.150 INCH, LEAD FREE, SOIC-16
Pin Count 28 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDSO-G16
JESD-609 Code e3
Length 36.83 mm 9.9 mm
Number of Functions 1 1
Number of Terminals 28 16
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 100 s 30 s
Seated Height-Max 4.83 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount NO YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 3.9 mm
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare ISD1616BSYI01 with alternatives