I17210XYIR01
vs
ISD33150ED
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
INFORMATION STORAGE DEVICES
|
Part Package Code |
DIE
|
|
Package Description |
DIE,
|
TSSOP, TSSOP28,.53,22
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-G28
|
Number of Functions |
1
|
1
|
On Chip Memory Type |
FLASH
|
EEPROM
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
TSSOP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
420 s
|
157.1 s
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Number of Terminals |
|
28
|
Package Equivalence Code |
|
TSSOP28,.53,22
|
Supply Current-Max |
|
40 mA
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
0.55 mm
|
|
|
|
Compare I17210XYIR01 with alternatives
Compare ISD33150ED with alternatives