I17210XYIR01 vs ISD33150ED feature comparison

I17210XYIR01 Winbond Electronics Corp

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ISD33150ED Nuvoton Technology Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP INFORMATION STORAGE DEVICES
Part Package Code DIE
Package Description DIE, TSSOP, TSSOP28,.53,22
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code X-XUUC-N R-PDSO-G28
Number of Functions 1 1
On Chip Memory Type FLASH EEPROM
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 420 s 157.1 s
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 2.4 V 2.7 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Number of Terminals 28
Package Equivalence Code TSSOP28,.53,22
Supply Current-Max 40 mA
Technology CMOS
Terminal Finish TIN LEAD
Terminal Pitch 0.55 mm

Compare I17210XYIR01 with alternatives

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