I17210XYIR01 vs I1740SY01 feature comparison

I17210XYIR01 Winbond Electronics Corp

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I1740SY01 Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE SOIC
Package Description DIE, SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code X-XUUC-N R-PDSO-G28
Number of Functions 1 1
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 420 s 80 s
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 1 1
Pin Count 28
JESD-609 Code e3
Length 17.93 mm
Number of Terminals 28
Package Equivalence Code SOP28,.4
Seated Height-Max 2.64 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Width 7.52 mm

Compare I17210XYIR01 with alternatives

Compare I1740SY01 with alternatives