I17210PY
vs
ISD1616BPI01
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Pin Count |
28
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
|
| Length |
36.83 mm
|
19.05 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
16
|
| On Chip Memory Type |
FLASH
|
FLASH
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
420 s
|
30 s
|
| Seated Height-Max |
4.83 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Application |
|
GREETING CARDS; TOYS; ANNUNCIATORS
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Current-Max |
|
20 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare I17210PY with alternatives
Compare ISD1616BPI01 with alternatives