HZU9.1B2TLF
vs
PDZ9.1B,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
NXP SEMICONDUCTORS
Package Description
R-PDSO-G2
PLASTIC, SMD, UMD2, SC-76, 2 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
R-PDSO-G2
R-PDSO-G2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.2 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
9.04 V
9.1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Voltage Tol-Max
2.1%
2.1%
Working Test Current
5 mA
5 mA
Base Number Matches
2
2
Rohs Code
Part Package Code
SOD
Pin Count
2
Manufacturer Package Code
SOD323
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
260
Reverse Current-Max
0.5 µA
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
5.5 mV/°C
Compare HZU9.1B2TLF with alternatives
Compare PDZ9.1B,115 with alternatives