HYS72V8220GU-8
vs
W3DG7216V7D2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SIEMENS A G
MICROSEMI CORP
Part Package Code
DIMM
DIMM
Package Description
,
DIMM,
Pin Count
168
168
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
DUAL BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
6 ns
Memory Density
603979776 bit
603979776 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
2
1
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX72
8MX72
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
Additional Feature
AUTO/SELF REFRESH
JESD-30 Code
R-XDMA-N168
Number of Terminals
168
Package Body Material
UNSPECIFIED
Package Code
DIMM
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Self Refresh
YES
Surface Mount
NO
Terminal Form
NO LEAD
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HYS72V8220GU-8 with alternatives
Compare W3DG7216V7D2 with alternatives