HYS64T256022EDL-2.5-B vs MT16HTS25664HY-800XX feature comparison

HYS64T256022EDL-2.5-B Qimonda AG

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MT16HTS25664HY-800XX Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer QIMONDA AG MICRON TECHNOLOGY INC
Part Package Code DIMM SODIMM
Package Description DIMM, DIMM200,24 DIMM,
Pin Count 200 200
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 0.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-XDMA-N200 R-XZMA-N200
Memory Density 17179869184 bit 17179869184 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 65 °C 70 °C
Operating Temperature-Min
Organization 256MX64 256MX64
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM200,24
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192
Self Refresh YES YES
Supply Current-Max 2.25 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.6 mm
Terminal Position DUAL ZIG-ZAG
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e4
Length 67.6 mm
Seated Height-Max 3.8 mm
Terminal Finish GOLD
Width 30 mm

Compare HYS64T256022EDL-2.5-B with alternatives

Compare MT16HTS25664HY-800XX with alternatives