HYS64D128021EBDL-5-B vs M470L2923BN0-CB0 feature comparison

HYS64D128021EBDL-5-B Qimonda AG

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M470L2923BN0-CB0 Samsung Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer QIMONDA AG SAMSUNG SEMICONDUCTOR INC
Part Package Code MODULE SODIMM
Package Description DIMM, DIMM200,24 DIMM, DIMM200,24
Pin Count 200 200
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 0.5 ns 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 200 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDMA-N200 R-XZMA-N200
JESD-609 Code e3
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128MX64 128MX64
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM200,24 DIMM200,24
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Self Refresh YES YES
Standby Current-Max 0.06 A 0.08 A
Supply Current-Max 2.86 mA 3.12 mA
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.5 V 2.3 V
Supply Voltage-Nom (Vsup) 2.6 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.6 mm 0.6 mm
Terminal Position DUAL ZIG-ZAG
Base Number Matches 2 1
Moisture Sensitivity Level 1

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