HYMP564U648-E3 vs EBE51UD8ABFA-4C-E feature comparison

HYMP564U648-E3 SK Hynix Inc

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EBE51UD8ABFA-4C-E Micron Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC MICRON TECHNOLOGY INC
Part Package Code DIMM
Package Description DIMM, DIMM240,40 DIMM, DIMM244,24
Pin Count 240
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 0.6 ns 0.6 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 200 MHz 400 MHz
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N240 R-PDMA-N244
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Number of Functions 1
Number of Ports 1
Number of Terminals 240 244
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 55 °C 85 °C
Operating Temperature-Min
Organization 64MX64 64MX64
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIMM DIMM
Package Equivalence Code DIMM240,40 DIMM244,24
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Self Refresh YES
Standby Current-Max 0.04 A 0.064 A
Supply Current-Max 1.76 mA 2.4 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1 mm 0.6 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 2

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