HYMP125S64CP6-Y5 vs MT8HTF25664HZ-800XX feature comparison

HYMP125S64CP6-Y5 SK Hynix Inc

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MT8HTF25664HZ-800XX Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SK HYNIX INC MICRON TECHNOLOGY INC
Part Package Code MODULE SODIMM
Package Description ROHS COMPLIANT, SODIMM-200 DIMM,
Pin Count 200 200
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Time-Max 0.45 ns
Additional Feature AUTO/SELF REFRESH AUTO REFRESH
JESD-30 Code R-XDMA-N200 R-XZMA-N200
Memory Density 17179869184 bit 17179869184 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 65 °C 70 °C
Operating Temperature-Min
Organization 256MX64 256MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Self Refresh YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL ZIG-ZAG
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Access Mode SINGLE BANK PAGE BURST
JESD-609 Code e4
Length 67.6 mm
Seated Height-Max 3.8 mm
Terminal Finish GOLD
Width 30 mm

Compare HYMP125S64CP6-Y5 with alternatives

Compare MT8HTF25664HZ-800XX with alternatives