HYMP112S64LMP8-E3 vs W3EG264M64EFSU265D4IS feature comparison

HYMP112S64LMP8-E3 SK Hynix Inc

Buy Now Datasheet

W3EG264M64EFSU265D4IS Microsemi Corporation

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC MICROSEMI CORP
Package Description DIMM, DIMM200,24 DIMM,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Time-Max 0.6 ns 0.75 ns
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PDMA-N200 R-XDMA-N200
JESD-609 Code e3
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Moisture Sensitivity Level 1
Number of Terminals 200 200
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Temperature-Max 55 °C
Operating Temperature-Min
Organization 128MX64 128MX64
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM200,24
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192
Standby Current-Max 0.048 A
Supply Current-Max 1.96 mA
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.6 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Part Package Code MODULE
Pin Count 200
Access Mode DUAL BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
Number of Functions 1
Number of Ports 1
Operating Mode SYNCHRONOUS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HYMP112S64LMP8-E3 with alternatives

Compare W3EG264M64EFSU265D4IS with alternatives