HYMD216646DL6-M
vs
V826616J24SAIY-B0
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SK HYNIX INC
|
PROMOS TECHNOLOGIES INC
|
| Package Description |
DIMM, DIMM184
|
DIMM, DIMM184
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.32
|
| Access Time-Max |
0.75 ns
|
0.75 ns
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDMA-N184
|
R-PDMA-N184
|
| Memory Density |
1073741824 bit
|
1073741824 bit
|
| Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
| Memory Width |
64
|
64
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
184
|
184
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16MX64
|
16MX64
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM184
|
DIMM184
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Supply Current-Max |
0.88 mA
|
1.21 mA
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare HYMD216646DL6-M with alternatives
Compare V826616J24SAIY-B0 with alternatives