HYM7V75A801BTZG-8
vs
HB52D88DC-B6FL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
HITACHI LTD
Part Package Code
MODULE
MODULE
Package Description
DIMM, DIMM144,32
DIMM,
Pin Count
144
144
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
DUAL BANK PAGE BURST
Access Time-Max
6 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM
Clock Frequency-Max (fCLK)
125 MHz
I/O Type
COMMON
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
603979776 bit
67108864 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
65 °C
Operating Temperature-Min
Organization
8MX72
8MX8
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM144,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Self Refresh
YES
YES
Standby Current-Max
0.018 A
Supply Current-Max
1.8 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Length
67.6 mm
Seated Height-Max
31.75 mm
Width
3.8 mm
Compare HYM7V75A801BTZG-8 with alternatives
Compare HB52D88DC-B6FL with alternatives