HYM5V72A400ATN-60
vs
HYB39S256800DCL-8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
QIMONDA AG
Part Package Code
DIMM
Package Description
DIMM,
FBGA, BGA54,9X9,32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.24
Category CO2 Kg
12
12
Access Mode
FAST PAGE
JESD-30 Code
R-XDMA-N
S-PBGA-B54
Memory Density
301989888 bit
268435456 bit
Memory IC Type
FAST PAGE DRAM MODULE
SYNCHRONOUS DRAM
Memory Width
72
8
Number of Functions
1
Number of Ports
1
Number of Words
4194304 words
33554432 words
Number of Words Code
4000000
32000000
Operating Mode
ASYNCHRONOUS
Organization
4MX72
32MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIMM
FBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
8192
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
BALL
Terminal Position
DUAL
BOTTOM
Base Number Matches
1
2
Compliance Temperature Grade
Commercial: +0C to +70C
Access Time-Max
6 ns
Clock Frequency-Max (fCLK)
125 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
Number of Terminals
54
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
BGA54,9X9,32
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.002 A
Supply Current-Max
0.16 mA
Temperature Grade
COMMERCIAL
Terminal Pitch
0.8 mm
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