HYM581000BLM-60
vs
KMM581000AN-7
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SIMM
SIMM
Package Description
SIMM, SIM30
SIMM, SIM30
Pin Count
30
30
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
FAST PAGE
Access Time-Max
60 ns
70 ns
Additional Feature
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O Type
COMMON
COMMON
JESD-30 Code
R-XSMA-N30
R-XSMA-N30
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FAST PAGE DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
30
30
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX8
1MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
SIMM
SIMM
Package Equivalence Code
SIM30
SIM30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
1024
1024
Seated Height-Max
12.7 mm
16.51 mm
Standby Current-Max
0.0004 A
0.002 A
Supply Current-Max
0.23 mA
0.21 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Compare HYM581000BLM-60 with alternatives
Compare KMM581000AN-7 with alternatives