HYM532512M-80
vs
MCM32512ASG80
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
SIMM
|
|
Package Description |
SIMM, SSIM72
|
SIMM, SSIM72
|
Pin Count |
72
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.02
|
|
Access Mode |
FAST PAGE
|
|
Access Time-Max |
80 ns
|
80 ns
|
Additional Feature |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-XSMA-N72
|
R-PSMA-N72
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FAST PAGE DRAM MODULE
|
FAST PAGE DRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
72
|
72
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512KX32
|
512KX32
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
SIMM
|
SIMM
|
Package Equivalence Code |
SSIM72
|
SSIM72
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
512
|
512
|
Seated Height-Max |
25.4 mm
|
25.527 mm
|
Self Refresh |
NO
|
NO
|
Standby Current-Max |
0.016 A
|
0.016 A
|
Supply Current-Max |
0.576 mA
|
0.576 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
SINGLE
|
SINGLE
|
Base Number Matches |
1
|
3
|
Power Supplies |
|
5 V
|
|
|
|
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