HYM532214ATE-60
vs
KMM5322104CKUG-6
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SK HYNIX INC
|
SAMSUNG ELECTRO-MECHANICS
|
| Part Package Code |
SIMM
|
|
| Package Description |
SIMM, SSIM72
|
SIMM-72
|
| Pin Count |
72
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.02
|
|
| Access Mode |
FAST PAGE WITH EDO
|
FAST PAGE
|
| Access Time-Max |
60 ns
|
60 ns
|
| Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
SELF REFRESH; WD-MAX
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-XSMA-N72
|
R-XSMA-N72
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
EDO DRAM MODULE
|
DRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
72
|
72
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
2MX32
|
2MX32
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
SIMM
|
SIMM
|
| Package Equivalence Code |
SSIM72
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
|
| Refresh Cycles |
2048
|
|
| Seated Height-Max |
25.4 mm
|
24.63 mm
|
| Self Refresh |
NO
|
|
| Standby Current-Max |
0.004 A
|
|
| Supply Current-Max |
0.48 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
2
|
| Length |
|
107.95 mm
|
| Width |
|
5.08 mm
|
|
|
|
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