HYE18L256160BCL-7.5
vs
HYB39S256160FFL-6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
INFINEON TECHNOLOGIES AG
Part Package Code
BGA
BGA
Package Description
FBGA,
TFBGA,
Pin Count
54
54
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B54
R-PBGA-B54
Length
12 mm
12 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
3 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Seated Height-Max
1.2 mm
Compare HYE18L256160BCL-7.5 with alternatives
Compare HYB39S256160FFL-6 with alternatives