HYB3165165BT-50
vs
K4E641612C-TL500
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SIEMENS A G
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
,
TSOP2,
Pin Count
50
50
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE WITH EDO
FAST PAGE WITH EDO
Access Time-Max
50 ns
50 ns
JESD-30 Code
R-PDSO-G50
R-PDSO-G50
Memory Density
67108864 bit
67108864 bit
Memory IC Type
EDO DRAM
EDO DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
50
50
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
Length
20.95 mm
Seated Height-Max
1.2 mm
Self Refresh
YES
Terminal Pitch
0.8 mm
Width
10.16 mm
Compare HYB3165165BT-50 with alternatives
Compare K4E641612C-TL500 with alternatives