HYB3118165BST-70
vs
EDI4161MEV70SM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
WHITE ELECTRONIC DESIGNS CORP
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
70 ns
|
70 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
EDO DRAM
|
EDO DRAM
|
| Memory Width |
16
|
16
|
| Number of Terminals |
44
|
44
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
1MX16
|
1MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
TSOP
|
| Package Equivalence Code |
TSOP44/50,.46,32
|
TSOP44/50,.46,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
1024
|
1024
|
| Self Refresh |
NO
|
NO
|
| Standby Current-Max |
0.001 A
|
0.001 A
|
| Supply Current-Max |
0.16 mA
|
0.16 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HYB3118165BST-70 with alternatives
Compare EDI4161MEV70SM with alternatives