HYB18TC1G160C2F-25F vs MT47H64M16HW-25:H feature comparison

HYB18TC1G160C2F-25F Qimonda AG

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MT47H64M16HW-25:H Micron Technology Inc

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Yes No
Obsolete Obsolete
QIMONDA AG MICRON TECHNOLOGY INC
BGA BGA
TFBGA, BGA84,9X15,32 TFBGA,
84 84
unknown compliant
EAR99 EAR99
8542.32.00.32 8542.32.00.32
MULTI BANK PAGE BURST MULTI BANK PAGE BURST
0.4 ns 0.4 ns
AUTO/SELF REFRESH AUTO/SELF REFRESH
400 MHz
COMMON
4,8
R-PBGA-B84 R-PBGA-B84
12.5 mm 12.5 mm
1073741824 bit 1073741824 bit
DDR2 DRAM DDR2 DRAM
16 16
1 1
1 1
84 84
67108864 words 67108864 words
64000000 64000000
SYNCHRONOUS SYNCHRONOUS
64MX16 64MX16
3-STATE
PLASTIC/EPOXY PLASTIC/EPOXY
TFBGA TFBGA
BGA84,9X15,32
RECTANGULAR RECTANGULAR
GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Not Qualified Not Qualified
8192
1.2 mm 1.2 mm
YES YES
4,8
0.021 A
0.214 mA
1.9 V 1.9 V
1.7 V 1.7 V
1.8 V 1.8 V
YES YES
CMOS CMOS
BALL BALL
0.8 mm 0.8 mm
BOTTOM BOTTOM
8 mm 8 mm
1 1
No
e0
85 °C
OTHER
TIN LEAD SILVER

Compare HYB18TC1G160C2F-25F with alternatives

Compare MT47H64M16HW-25:H with alternatives