HYB18T256160BFL-3.7
vs
MT47H16M16FG-37EL:B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
QIMONDA AG
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA, BGA84,9X15,32
|
8 X 14 MM, FBGA-84
|
| Pin Count |
84
|
84
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.24
|
8542.32.00.24
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
0.5 ns
|
0.5 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
266 MHz
|
266 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| Interleaved Burst Length |
4,8
|
4,8
|
| JESD-30 Code |
R-PBGA-B84
|
R-PBGA-B84
|
| Length |
12.5 mm
|
14 mm
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
DDR2 DRAM
|
DDR2 DRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
84
|
84
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16MX16
|
16MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA84,9X15,32
|
BGA84,9X15,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
4,8
|
4,8
|
| Standby Current-Max |
0.033 A
|
0.005 A
|
| Supply Current-Max |
0.135 mA
|
0.3 mA
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD SILVER
|
|
|
|
Compare HYB18T256160BFL-3.7 with alternatives
Compare MT47H16M16FG-37EL:B with alternatives