HY67V36400BG-7
vs
IS61LPD51236-250B2I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
119
119
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
2.6 ns
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
18874368 bit
Memory IC Type
CACHE SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
119
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX36
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.41 mm
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Compare HY67V36400BG-7 with alternatives
Compare IS61LPD51236-250B2I with alternatives