HY62V8100BLLT1-70 vs W24L11T-70LE feature comparison

HY62V8100BLLT1-70 SK Hynix Inc

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W24L11T-70LE Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC WINBOND ELECTRONICS CORP
Part Package Code TSOP1 TSOP1
Package Description 8 X 20 MM, TSOP1-32 8 X 20 MM, TSOP1-32
Pin Count 32 32
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 18.4 mm 18.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Equivalence Code TSSOP32,.8,20 TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.035 mA 0.04 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 3 1
Additional Feature CAN ALSO OPERATE AT 5V SUPPLY
JESD-609 Code e0
Terminal Finish TIN LEAD

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